HCTS138D 데이터 시트보기 (PDF) - Intersil
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HCTS138D Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
85 x 101 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
A1
(2)
HCTS138MS
HCTS138MS
A0
VCC
Y0
(1)
(16)
(15)
A2 (3)
NC
E1 (4)
E2 (5)
E3 (6)
NC
(14) Y1
NC
(13) Y2
(12) Y3
(11) Y4
NC
(7)
(8)
(9)
(10)
Y7
GND
Y6
Y5
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS138 is TA14461A.
Spec Number 518605
518
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