HCTS75MS 데이터 시트보기 (PDF) - Intersil

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HCTS75MS

Radiation Hardened Dual 2-Bit Bistable Transparent Latch

Intersil 

Die Characteristics

DIE DIMENSIONS:

89 x 88 mils

2.25 x 2.24mm

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 x 4 mils

Metallization Mask Layout

D0 1

(2)

HCTS75MS

HCTS75MS

Q0 1

(1)

Q0 1

(16)

D1 1 (3)

E 2 (4)

VCC (5)

D0 2 (6)

(15) 1 Q1

(14) 1 Q1

(13) 1 E

(12) GND

D1 2 (7)

(11) 2 Q0

(8)

Q1 2

(9)

Q1 2

(10)

Q0 2

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS75 is TA14442A.

Spec Number 518625

477

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