CD4070 데이터 시트보기 (PDF) - Intersil

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CD4070

CMOS Quad Exclusive OR and Exclusive NOR Gates

Intersil 

CD4070BMS, CD4077BMS

Typical Performance Characteristics (Continued)

AMBIENT TEMPERATURE (TA) = +25oC

LOAD CAPACITANCE (CL) = 50pF

300

200

100

0

5

10

15

20

SUPPLY VOLTAGE (VDD) (V)

FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A

FUNCTION OF SUPPLY VOLTAGE

105 6

4

AMBIENT TEMPERATURE (TA) = +25oC

2

104 6

4

2

103 6

4

2

102 6

4

2

SUPPLY VOLTAGE

(VDD) = 15V

10V

10V

10

6

4

2

16

4

2

10-1

2

10-1

4 68 2

1

5V

LOAD CAPACITANCE

CL = 50pF

CL = 15pF

4 68 2 4 68 2 4 68 2 4 68

10

102

103

104

INPUT FREQUENCY (fI) (kHz)

FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A

FUNCTION OF INPUT FREQUENCY

Chip Dimensions and Pad Layout

CD4077BMSH

Dimensions and pad layout for CD4070BMSH are

identical

Dimensions in parenthesis are in millimeters and are

derived from the basic inch dimensions as indicated.

Grid graduations are in mils (10-3 inch).

METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6kÅ, Silane

BOND PADS: 0.004 inches X 0.004 inches MIN

DIE THICKNESS: 0.0198 inches - 0.0218 inches

7-462

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