HCTS85D 데이터 시트보기 (PDF) - Intersil

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HCTS85D

Radiation Hardened 4-Bit Magnitude Comparator

Intersil 

HCTS85MS

Die Characteristics

DIE DIMENSIONS:

100 x 100 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS85MS

(A<B)IN

B3

VCC

A3

(2)

(1)

(16)

(15)

(A=B)IN(3)

(A>B)IN(4)

(A<B)OUT(5)

(A=B)OUT(6)

(14) B2

(13) A2

(12) A1

(11) B1

(7)

(8)

(9)

(10)

(A>B)OUT

GND

B0

A0

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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

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Spec Number 518624

9

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