HCTS93D 데이터 시트보기 (PDF) - Intersil
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HCTS93D Datasheet PDF : 9 Pages
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HCTS93MS
Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25mm x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS93MS
MR1
CP1
CP0
(2)
(1)
(14)
MR2 (3)
NC (4)
(13) NC
(12) Q0
(11) Q3
(10) GND
VCC (5)
(9) Q1
(6)
(7)
(8)
NC
NC
Q2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS93 is TA14454A.
Spec Number 518622
488
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