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73M223-CL 데이터 시트보기 (PDF) - TDK Corporation

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73M223-CL
TDK
TDK Corporation TDK
73M223-CL Datasheet PDF : 6 Pages
1 2 3 4 5 6
73M223
1200 Baud FSK Modem
PACKAGE PIN DESIGNATIONS
(Top View)
CAUTION: Use handling procedures necessary for
a static sensitive component.
VDD 1
RXA 2
CAP 3
RXF 4
FIL 5
TEST 6
7; 7
VSS 8
16 TXA
15 CLK
14 OSC2
13 OSC1
12 TXD
11 RXD
10 6<1
9 SYNC
16-Pin DIP and
16-Lead SOL
ORDERING INFORMATION
PART DESCRIPTION
73M223
16-Pin Plastic DIP
16-Lead SOL
ORDER NUMBER
73M223-CP
73M223-CL
PACKAGING MARK
73M223-CP
73M223-CL
No responsibility is assumed by TDK Semiconductor Corporation for use of this product nor for any infringements of patents and trademarks
or other rights of third parties resulting from its use. No license is granted under any patents, patent rights or trademarks of TDK
Semiconductor Corporation and the company reserves the right to make changes in specifications at any time without notice. Accordingly, the
reader is cautioned to verify that you are referencing the most current data sheet before placing orders. To do so, see our web site at
http://www.tsc.tdk.com or contact your local TDK Semiconductor representative.
TDK Semiconductor Corp., 2642 Michelle Dr., Tustin, CA 92780, (714) 508-8800, FAX (714) 508-8877, http://www.tsc.tdk.com
©1990 TDK Semiconductor Corporation
02/23/98- rev.B
6

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