HMC559 데이터 시트보기 (PDF) - Micross Components

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HMC559

GaAs PHEMT MMIC POWER AMPLIFIER

Micross Components 

v03.0208

Outline Drawing

3

HMC559

GaAs PHEMT MMIC

POWER AMPLIFIER, DC - 20 GHz

Die Packaging Information [1]

Standard

Alternate

GP-1 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES:

1. ALL DIMENSIONS IN INCHES [MILLIMETERS]

2. DIE THICKNESS IS 0.004 (0.100)

3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE

4. BOND PAD METALIZATION: GOLD

5. BACKSIDE METALLIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS

8. OVERALL DIE SIZE IS ±.002

3 - 66

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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