D78F9189CT 데이터 시트보기 (PDF) - NEC => Renesas Technology

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D78F9189CT

UPD78F9189CT, D78F9189CT / 8-Bit Single-chip Microcontroller

NEC => Renesas Technology 

CHAPTER 21 RECOMMENDED SOLDERING CONDITIONS

The µPD78F9189CT/μPD789188 should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

Table 21-1. Surface Mounting Type Soldering Conditions

µPD78F9189CT/μPD789188CT:

32-pin plastic shrink DIP (400mil)

Soldering Method

Wave soldering

Partial heating

Soldering Conditions

Solder bath temperature: 260 °C max., Time: 10 seconds max.

Pin temperature: 300 °C max., Time: 3 seconds max. (per each pin)

Caution Do not use different soldering methods together (except for partial heating).

User’s Manual 2nd edition

237

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