108962-HMC497LP4 데이터 시트보기 (PDF) - Analog Devices
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108962-HMC497LP4 Datasheet PDF : 10 Pages
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HMC497LP4 / 497LP4E
v04.1108
SiGe WIDEBAND DIRECT
MODULATOR RFIC, 100 - 4000 MHz
Absolute Maximum Ratings
Vcc1, Vcc2
0V to +6V
LO Input Power
+18 dBm
Baseband Input Voltage (AC + DC)
(Reference to GND)
0.0V to +2.8V
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Channel Temperature
150 °C
Continuous Pdiss (T = 85°C)
(Derate 30 mW/°C above 85°C)
Thermal Resistance (Rth)
(junction to lead)
Storage Temperature
E Operating Temperature
ESD Sensitivity (HBM)
1.8 Watts
34 °C/W
-65 to +150 °C
-40 to +85 °C
Class 1A
T Outline Drawing
SOLE NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
B 2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
O 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST
BE SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED
PCB LAND PATTERN.
Package Information
Part Number
HMC497LP4
Package Body Material
Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
HMC497LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
MSL Rating
MSL1 [1]
MSL1 [2]
Package Marking [3]
H497
XXXX
H497
XXXX
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