XM1006-BD 데이터 시트보기 (PDF) - Mimix Broadband

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XM1006-BD

13.0-25.0 GHz GaAs MMIC Image Reject Mixer

Mimix Broadband 

13.0-25.0 GHz GaAs MMIC

Image Reject Mixer

February 2007 - Rev 26-Feb-07

Mechanical Drawing

2.500

(0.098)

1.885

(0.074)

1

1.424

(0.056)

2

M1006-BD

3

1.250

(0.049)

XM1006-BD

4

0.0

0.0

1.424

2.100

(0.056)

(0.083)

(Note: Engineering designator is 18KWR0327)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.25 mg.

Bond Pad #1 (RF)

Bond Pad #2 (IF1)

Bond Pad #3 (LO)

Bond Pad #4 (IF2)

RF Arrangement

IF1

2

RF 1

3 LO

XM1006-BD

4

IF2

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Page 4 of 6

Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

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