25X40BLSIG 데이터 시트보기 (PDF) - Winbond

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25X40BLSIG

1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

Winbond 

8-Pad WSON 6x5mm Cont’d.

W25X10BL/20BL/40BL

SYMBOL

MILLIMETERS

MIN

TYP.

MAX

SOLDER PATTERN

M

3.40

N

4.30

P

6.00

Q

0.50

R

0.75

INCHES

MIN

TYP.

MAX

0.1338

0.1692

0.2360

0.0196

0.0255

Notes:

1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of

exposed PCB vias under the pad.

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