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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

W159 데이터 시트보기 (PDF) - Cypress Semiconductor

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W159 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Package Diagram
56-Pin Small Shrink Outline Package (SSOP, 300 mils)
W159
Summary of nominal dimensions in inches:
Body Width: 0.296
Lead Pitch: 0.025
Body Length: 0.625
Body Height: 0.102
Document #: 38-07163 Rev. *A
Page 10 of 11
© Cypress Semiconductor Corporation, 2001. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.

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