TGA1073B-SCC(2005) 데이터 시트보기 (PDF) - TriQuint Semiconductor
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TGA1073B-SCC Datasheet PDF : 7 Pages
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Product Datasheet
TGA1073B-SCC
Vg
0.01uF
RF in
Chip Assembly and Bonding Diagram
100pF
Vd
100pF
0.01uF
RF out
Recommended:
Solder MMIC to carrier using AuSn 80/20
Bond MMIC RF in and RF out with 5mil Au ribbon
Ribbon should be as short as possible
Bond DC Lines as shown with 1 mil bondwires
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
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