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MM912G634CM1AE

Integrated S12 Based Relay Driver with LIN

Freescale Semiconductor 

Ordering Information

1

Ordering Information

Table 1. ORDERING INFORMATION

Device

(Add an R2 suffix for

Tape and Reel orders)

MM912G634CM1AE

MM912G634CV1AE

MM912G634CV2AP

Temperature

Range (TA)

-40°C to 125°C

-40°C to 105°C

-40°C to 105°C

Package

LQFP48-EP

LQFP48-EP

LQFP48

Max. Bus

Frequency in MHz

(fBUSMAX)

20

20

16

Flash (kB)

48(2)

48(2)

48(2)

Data Flash (kB) RAM (kB)

2(3)

2(4)

2(3)

2(4)

2(3)

2(4)

Analog

Option(1)

A1

A1

A2

MM912H634CM1AE -40°C to 125°C LQFP48-EP

20

64

4

6

A1

MM912H634CV1AE -40°C to 105°C LQFP48-EP

20

64

4

6

A1

Note:

1. See Table 2.

2. The 48 kB Flash option (MM912G634) using the same S12I64 MCU with the tested FLASHSIZE reduced to 48 kB. This will limit the

usable Flash area to the first 48 kB (0x3_4000-0x3_FFFF).

3. The 48 kB Flash option (MM912G634) using the same S12I64 MCU with the tested Data - FLASHSIZE reduced to 2.0 kB. This will limit

the usable Data Flash area to the first 2.0 kB (0x0_4400-0x0_4BFF).

4. The 48 kB Flash option (MM912G634) using the same S12I64 MCU with the tested RAMSIZE reduced to 2.0 kB. This will limit the

usable RAM area to the first 2.0 kB (0x0_2800-0x0_2FFF).

Table 2. Analog Options(5)

Feature

A1

A2

Battery Sense Module

YES

YES

Current Sense Module

YES

NO

2nd High Side Output (HS2)

YES

YES

Wake-up Inputs (Lx)

L0…L5

L0…L3

Hall Supply Output (HSUP)

YES

YES

LIN Module

YES

YES

Note:

5. This table only highlights the analog die differences between the derivatives. Features highlighted as “NO” or the Lx Inputs not

mentioned are not available in the specific option and not bonded out and/or not tested. See Section 4.3.3, “Analog Die Options for

detailed information.

MM912_634 Advance Information, Rev. 4.0

Freescale Semiconductor

2

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