HMC560(2005) 데이터 시트보기 (PDF) - Hittite Microwave
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HMC560 Datasheet PDF : 6 Pages
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v00.0705
HMC560
GaAs MMIC DOUBLE-BALANCED
MIXER, 24 - 40 GHz
Absolute Maximum Ratings
RF / IF Input
LO Drive
IF DC Current
Channel Temperature
Continuous Pdiss (T= 85 °C )
(derate 14.79 mW/ °C above 85 °C)
Thermal Resistance (RTH)
(channel to die bottom)
Storage Temperature
Operating Temperature
+25 dBm
+23 dBm
±2 mA
150 °C/W
0.961 W
67.6 °C/W
-65 to +150 °C
-55 to +85 °C
MxN Spurious Outputs
as a Down Converter
nLO
mRF
0
1
2
3
4
0
xx
-5
5
1
3
0
25
2
58
48
49
58
3
78
73
63
83
4
88
85
89
RF = 24 GHz @ -10 dBm
LO = 25 GHz @ +13 dBm
All values in dBc below IF output power level.
3
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Die Packaging Information [1]
Standard
Alternate
WP-7
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE)
COLLET TOOLS. TO PRECLUDE THE RISK OF PERMANENT
DAMAGE, NO CONTACT TO THE DIE SURFACE IS ALLOWED
WITHIN THIS RECTANGULAR AREA.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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