GP1S092HCPIF 데이터 시트보기 (PDF) - Sharp Electronics
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GP1S092HCPIF
Sharp Electronics
GP1S092HCPIF Datasheet PDF : 13 Pages
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● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please solder within one time.
MAX
240˚C
200˚C
1 to 4˚C/s
MAX
160˚C
GP1S092HCPIF
1 to 4˚C/s
1 to 4˚C/s
25˚C
MAX10s
MAX120s
MAX60s
MAX90s
Hand soldering
Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C.
Please solder within one time.
Please don't touch the terminals directly by soldering iron.
Soldered product shall treat at normal temperature.
Other notice
Please take care not to let any external force exert on lead pins.
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
Lead terminals
Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solderability with
actual conditions and confirm. And the uniformity in color for the lead terminals are not specified.
Sheet No.: D3-A00201EN
9
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