FX5-20P-SH 데이터 시트보기 (PDF) - HIROSE ELECTRIC
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FX5-20P-SH Datasheet PDF : 7 Pages
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BRecommended Temperature Profile
Less than 5 seconds
250
230ç
200
150
(ç)
100
200ç
Applicable Conditions
150ç
160ç
Reflow system
Solder
:IR reflow
: Paste type 63 Sn/37 Pb
(Flux content 9 wt%)
Test board
: Glass epoxy 85mm x 60mm x 1.6 mm
Metal mask thickness: 0.15 mm
50
25ç
60 seconds
0
START
60
30 seconds
60~90 seconds
Preheating
20~30 seconds
Soldering
120
Recommended temperature profile.
The temperature may be slightly changed according to the solder
paste type and amount.
Time (Second)
BCleaning Conditions
1. Organic Solvent Cleaning
Solvent
IPA (Isopropyl alcohol)
Cold Cleaning Heat Cleaning
HCFC (Hydrochlorophloro carbon)
*Methylene chroride isn't suitable for this product solvent.
2. Liquid Cleaning
When liquid detergents (such as terpene, alkali saponifier) are used, please select the cleaning detergent according to the
influence table on metal or resin which is issued from each detergent manufacturer.In addition, please do not leave the
connector outdoor, in which moisture remains.
3. Cautions for Cleaning
As for organic solvent or liquid cleaning, if flux or detergent remains on the connector, it can cause electrical performance
degradation. Therefore, please make sure that the connector is thoroughly cleaned so that neither flux nor detergent is found
on the connector.
A211
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