10XS3435_V10 데이터 시트보기 (PDF) - Freescale Semiconductor
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10XS3435_V10 Datasheet PDF : 51 Pages
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DEVICE VARIATIONS
DEVICE VARIATIONS
Table 1. Device Variations
Characteristic
Symbol
Min
Typ
Max
Unit
Wake Input Clamp Voltage, ICL(WAKE) < 2.5 mA
VCL(WAKE)
10XS3435B
18
10XS3435D
20
V
25
32
27
35
Fault Detection Blanking Time
tFAULT
μs
10XS3435B
-
5.0
20
10XS3435D
-
5.0
10
Output Shutdown Delay Time
10XS3435B
10XS3435D
Peak Package Reflow Temperature During Reflow(1), (2)
tDETECT
TPPRT
μs
-
7.0
30
-
7.0
20
Note 2
°C
Notes
1. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
2. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
10XS3435
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
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