CMPT651 데이터 시트보기 (PDF) - Central Semiconductor
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CMPT651 Datasheet PDF : 2 Pages
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PROCESS CP314V
Small Signal Transistor
NPN - High Current Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
40 x 40 MILS
7.1 MILS
7.9 x 8.7 MILS
9.0 x 14 MILS
Al - 30,000Å
Au-As - 13,000Å
GROSS DIE PER 5 INCH WAFER
10,583
PRINCIPAL DEVICE TYPES
CBCP68
CBCX68
CMPT651
CZT651
MPS650
MPS651
w w w. c e n t r a l s e m i . c o m
R1 (22-March 2010)
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